|
working procedure
|
project
|
Process capability
|
remarks
|
|
classification
|
routine
|
special
|
|
product
|
Number of layers
|
Floors 1-6
|
|
|
|
Finished product shape
|
±0.1mm
|
±0.05mm
|
|
|
Dimensional tolerance
|
|
Minimum size of finished product
|
5*5mm
|
3*3mm
|
|
|
FPC plate thickness
|
Single panel: 0.08-0.13mm
|
Minimum: 0.05mm
|
Receiving orders outside the normal capacity
|
|
Double sided plate: 0.10-0.25mm
|
Minimum: 0.08mm
|
Need review before
|
|
Three layer plate: 0.20-0.25mm
|
Minimum: 0.18mm
|
|
|
Four layer plate: 0.25-0.30mm
|
Minimum: 0.20mm
|
|
|
FPC plate thickness tolerance
|
Single and double-sided plate: ± 0.03mm
|
|
|
|
Multilayer board: ± 0.05mm
|
|
|
|
Gold finger area tolerance
|
±0.03mm
|
|
|
|
engineering
|
Multilayer laminated structure
|
Three layer board: 1 double and 1 single
|
1 single
|
|
|
Design
|
Four layer board: 1 single, 1 double and 1 single;
|
1 double 1 double / 1 single 1 single 1 single
|
|
|
Minimum distance between line edge and forming edge
|
0.2mm
|
0.1mm
|
To achieve 0.1mm, it needs to be made by laser or fine steel mold
|
|
Mosaic size
|
Length * width: within 250mm * 300mm
|
Max. 250 * 500mm
|
Beyond special abilities
|
|
Process edge size
|
Single panel: single side ≥ 7mm
|
Unilateral ≥ 5mm
|
Review before receiving orders
|
|
Double sided plate: single side ≥ 7mm
|
Unilateral ≥ 5mm
|
|
|
Multilayer board: single side ≥ 12mm
|
Unilateral ≥ 10mm
|
|
|
drill hole
|
Borehole diameter
|
0.1-6.35mm
|
Minimum aperture 0.07mm
|
|
|
Slot hole diameter
|
0.8mm*1.5mm
|
0.5-1.0mm
|
|
|
Bore tolerance
|
PTH hole: ± 0.075mm
|
|
|
|
Npth hole: ± 0.05mm
|
|
|
|
Hole position accuracy
|
Primary drilling: ± 0.075mm
|
|
|
|
Secondary drilling: ± 0.1mm
|
|
|
|
copper plating
|
Hole copper thickness
|
Double sided board: 8-15um
|
According to customer requirements
|
Beyond special abilities
|
|
Multilayer board: 12-18um
|
According to customer requirements
|
Review before receiving orders
|
|
line
|
Ring edge of hole ring
|
Double sided plate: 0.125mm
|
0.1mm
|
|
|
Outer layer of multilayer board: ≥ 0.125mm
|
0.1mm
|
|
|
Inner layer of multilayer board: ≥ 0.15mm
|
0.1mm
|
|
|
PTH hole rim
|
Double sided plate: ≥ 0.1mm
|
|
|
|
Pad to line distance
|
Outer layer of multilayer board: ≥ 0.1mm
|
0.05mm
|
|
|
Inner layer of multilayer board: ≥ 0.15mm
|
0.1mm
|
|
|
Npth hole cutting copper
|
≥0.2mm
|
|
|
|
Grid size
|
0.4mm * 0.4mm, 45 ° tilt
|
|
|
|
Film compensation
|
1 / 3oz bottom copper: 0.02mm
|
|
|
|
1 / 2oz bottom copper: 0.025mm
|
|
|
|
1oz bottom copper: 0.035mm
|
|
|
|
For the independent line, 0.15mm shall be added on the basis of overall compensation
|
|
|
|
Minimum line width and line spacing
|
1 / 2oz bottom copper: 0.05mm
|
|
|
|
1oz bottom copper: 0.10mm
|
|
|
|
Line alignment
|
±0.075mm
|
|
|
|
Line coincidence
|
±0.075mm
|
|
|
|
Etching tolerance
|
±0.02mm
|
|
|
|
Fit
|
Covering film window opening hole
|
Drilling: 0.3mm
|
|
|
|
Minimum square window covering film
|
Borehole: 0.7mm
|
|
|
|
Minimum window spacing of covering film
|
Drilling: 0.5mm
|
0.3mm
|
|
|
Glue overflow of covering film
|
≤0.15mm
|
|
|
|
Coating alignment
|
≤0.2mm
|
≤0.1mm
|
|
|
printing
|
Resistance welding window from pad
|
0.10mm
|
|
|
|
Unilateral minimum distance
|
0.2mm
|
|
Minimum resistance bridge
|
0.25mm
|
|
|
|
Resistance welding thickness
|
10-25um
|
|
|
|
Minimum character line width
|
≥0.13mm
|
|
|
|
Minimum character line height
|
≥0.80mm
|
|
|
|
Minimum distance from character to pad
|
0.30mm
|
|
|
|
surface treatment
|
Thickness of gold and nickel
|
0.025um-0.075um/1-3um
|
|
|
|
Gold and nickel plating thickness
|
0.025um-0.075um/1-3um
|
0.1~0.25um
|
|
✆ Hotline：0755-26652383
Q Q
Website